It is an adhesive tape specially designed for use in the semiconductor wafer dicing process.
- Fixed wafers.
- Protects wafer surface from damage and reduces loss rate.
- Highly adaptable adhesion.
- No residual adhesive.
- Transparency: Improve the precision and efficiency of cutting.
- High Temperature Resistance: Stable to withstand high temperatures from 180°C to 200°C for a long time.
- Compatibility: Can be applied to different types of wafer materials and adapted to various semiconductor cutting equipment.
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