Aug 31 – Sep 2 

Wuxi Taihu International Expo Center, Wuxi, China

B4-992

As a landmark event for China’s semiconductor equipment and materials industry, CSEAC 2026 covers an exhibition area of over 70,000 ㎡. It gathers more than 1,300 industrial‑chain enterprises and hosts over 20 professional forums. Centering on hot‑topic themes including advanced packaging, wafer manufacturing, domestic material innovation and supply‑chain security, the show serves as a pivotal platform for technical exchange and business matching between upstream and downstream participants.

At this exhibition, UI‑Semiconductor Materials (Suzhou) Co., Ltd. will present its key semiconductor‑packaging consumable — ETFE film solutions at Booth B4‑992 in Wuxi. We look forward to face‑to‑face discussions with new and existing clients as well as industry peers, to jointly explore innovation paths for domestic semiconductor materials.

🤝 You are warmly welcome for on‑site communication Our technical and sales teams will be on‑site during the exhibition to support: ✅ Product sample viewing & performance discussion ✅ Process‑pain‑point analysis and material‑selection consultation ✅ Negotiations on new‑project cooperation

We sincerely invite industry partners to visit Booth B4‑992. Let us discuss opportunities within the advanced‑packaging sector and jointly empower China’s chip industry.

📍 Wuxi Taihu International Expo Center ⏰ Aug 31 – Sep 2 | UI‑Semiconductor Materials, Booth B4‑992. Looking forward to your visit!

Tel+86‑512‑65251314 

Mr. Xu: 17621711957 

Ms. Wang: 17768045433

Website

www.uiserials.com

Aug 31 – Sep 2 Wuxi Taihu International Expo Center Booth B4‑992 Looking forward to meeting you there!