Auxiliary tape specially designed for complete peeling of BG Tape from ultra‑thin wafers. It does not come into direct contact with chip circuitry and is used with automatic peeling equipment to complete the protective film stripping process after wafer thinning.
Low‑stress peeling: Significantly reduces wafer chipping risk for thin wafers; compatible with ultra‑thin silicon wafers (<50 μm) and bumped wafers.
Residue‑free & clean: Adhesive layer bonds only to the BG protective film without transferring onto chip circuitry, minimizing secondary cleaning steps.
Compatibility with multiple BG Tape types: Works with UV‑type and selected non‑UV thermal‑release BG Tapes.
Automation‑ready for mass production: Fits standard 8‑/12‑inch equipment, supports MES system integration, and meets high‑volume production requirements for semiconductor assembly & test facilities.
Back‑thinning process for power device wafers: IGBT, MOSFET, SiC
Ultra‑thin wafer processing for memory chips
Post‑backgrinding tape peeling for bumped wafers and TSV wafers
Fully‑automatic production lines for 8‑/12‑inch large‑size wafers
Supporting processes related to DBG (Dicing Before Grinding) technology
